hynix

June 18 (UPI) — South Korea’s SK hynix said Thursday that the company has shipped samples of its next-generation high-bandwidth memory chips, or HBM4E, to major customers.

SK hynix provided samples of the 12-stack HBM4E, which it says shows improvements in both performance and power efficiency, on schedule, according to the tech giant.

The firm noted that the new product delivers a data-processing speed of up to 16Gbps per pin while enhancing power efficiency by more than 20% compared with previous-generation models.

The corporation stated that the HBM4E features an upgraded interface and optimized architecture, which reduce data-transfer latency while ensuring reliable performance in high-bandwidth environments.

SK hynix expected the improvements to enable clients to process data more efficiently in AI data centers and large-scale computing systems.

Amid the AI boom, high-bandwidth memory, or HBM, has emerged as one of the most sought-after semiconductor products. SK hynix and its local rival, Samsung Electronics, are global leaders in the HBM supply chain.

“SK hynix has laid the foundation to strengthen its AI leadership with HBM4E based on its market-leading technological capabilities and manufacturing expertise,” SK hynix Chief Development Officer Ahn Hyun said in a statement.

“Through close collaboration with our partners, we will deliver the value needed in the market while reinforcing our technology leadership as a full-stack AI memory creator,” he added.

June 2 (Asia Today) — Nvidia CEO Jensen Huang visited the SK hynix booth at Computex 2026 in Taipei on Tuesday, meeting SK Group Chairman Chey Tae-won for a second straight day as the companies deepen their artificial intelligence partnership.

Huang, who met privately with Chey on Monday, examined SK hynix’s major memory products and wrote “Please Make More” on an HBM4E wafer displayed at the booth.

Chey also signaled that SK plans to expand production. He said the group aims to double wafer production capacity within five years as demand for memory chips is expected to surge.

Huang toured the booth with Chey and SK hynix executives. He signed the HBM4E wafer with the message “Please Make More” and wrote “LOVE SOCAMM” on a 192GB SOCAMM product.

SK hynix currently supplies Nvidia with its latest high-bandwidth memory, including sixth-generation HBM4, as well as high-performance low-power LPDDR5X memory. Huang said in his GTC Taipei keynote Monday that Nvidia will begin full-scale production of its next-generation AI accelerator, Vera Rubin, in the second half of this year.

As AI demand increases and memory supply shortages deepen, Chey said SK is moving quickly to expand production.

“The memory bottleneck is expected to continue until 2030,” Chey told reporters at the SK hynix booth. “We are pushing forward at full speed to expand production capacity.”

“Building new memory fabs requires enormous investment and takes at least three years,” he said. “Despite these challenges, we plan to double wafer production capacity over the next five years.”

It was the first time SK Group publicly presented a specific goal of doubling its overall production capacity within five years. SK hynix is making large-scale investments to strengthen production capacity, including projects at its M15X and P&T7 facilities in Cheongju, the Yongin semiconductor cluster and an advanced packaging plant in the United States.

— Reported by Asia Today; translated by UPI

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Original Korean report: https://www.asiatoday.co.kr/kn/view.php?key=20260602010000823