SK hynix ships samples of next-generation HBM4E memory chips
Samples of SK hynix’s 12-stack HBM4E memory chips. The chipmaker has delivered samples of the next-generation high-bandwidth memory products to its major customers. Photo by SK hynix
June 18 (UPI) — South Korea’s SK hynix said Thursday that the company has shipped samples of its next-generation high-bandwidth memory chips, or HBM4E, to major customers.
SK hynix provided samples of the 12-stack HBM4E, which it says shows improvements in both performance and power efficiency, on schedule, according to the tech giant.
The firm noted that the new product delivers a data-processing speed of up to 16Gbps per pin while enhancing power efficiency by more than 20% compared with previous-generation models.
The corporation stated that the HBM4E features an upgraded interface and optimized architecture, which reduce data-transfer latency while ensuring reliable performance in high-bandwidth environments.
SK hynix expected the improvements to enable clients to process data more efficiently in AI data centers and large-scale computing systems.
Amid the AI boom, high-bandwidth memory, or HBM, has emerged as one of the most sought-after semiconductor products. SK hynix and its local rival, Samsung Electronics, are global leaders in the HBM supply chain.
“SK hynix has laid the foundation to strengthen its AI leadership with HBM4E based on its market-leading technological capabilities and manufacturing expertise,” SK hynix Chief Development Officer Ahn Hyun said in a statement.
“Through close collaboration with our partners, we will deliver the value needed in the market while reinforcing our technology leadership as a full-stack AI memory creator,” he added.