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Samsung nabs $200B chip deal with Broadcom

Samsung Semiconductor Europe GmbH

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  • Samsung Electronics (SSNLF) has inked a memorandum of understanding to provide Broadcom (AVGO) with memory and foundry chips through 2030 in a deal worth more than $200B.
  • The memory component will focus on supplying HBM used in Broadcom’s next-generation AI

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